等温热处理对AlMgLi0.5Zn0.5Cu0.2轻质高熵合金半固态组织的影响
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华东交通大学 载运工具先进材料与激光增材制造南昌市重点实验室

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国家自然科学基金资助项目(51865011);江西省自然科学基金资助项目(20212BAB204008)


Effect of isothermal heat treatment on the semi-solid microstructure of AlMgLi0.5Zn0.5Cu0.2 light-weight high entropy alloy
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    摘要:

    采用等温热处理法制备了AlMgLi0.5Zn0.5Cu0.2轻质高熵合金半固态坯料,研究了保温温度和保温时间对AlMgLi0.5Zn0.5Cu0.2轻质高熵合金半固态组织演变影响。结果表明:随着保温温度增加,AlMgLi0.5Zn0.5Cu0.2轻质高熵合金的晶粒平均尺寸先减小后增大,而圆整度先增大后减小。随着保温时间的延长,AlMgLi0.5Zn0.5Cu0.2轻质高熵合金的晶粒平均尺寸和圆整度均增加。在460℃保温60min时,AlMgLi0.5Zn0.5Cu0.2轻质高熵合金的的半固态组织最佳,晶粒平均尺寸为41μm,圆整度为0.82,粗化系数K=20.95μm3/s。

    Abstract:

    The semi-solid billet of AlMgLi0.5Zn0.5Cu0.2 light-high entropy alloy was prepared by isothermal heat treatment and the effects of holding temperature and holding time on the microstructure evolution of AlMgLi0.5Zn0.5Cu0.2 light-high entropy alloy were investigated. The results show that, with the increase of holding temperature, the average grain size of semi-solid AlMgLi0.5Zn0.5Cu0.2 light-weight high entropy alloy decreases first and then increases, while the roundness of the grains increases first and then decreases. With the prolongation of holding time, the average grain size and roundness of AlMgLi0.5Zn0.5Cu0.2 light-weight high entropy alloy increase. The best semi-solid microstructure of AlMgLi0.5Zn0.5Cu0.2 light-weight high entropy alloy was obatined at 460℃ for 60min, whose average grain size is about 41μm, roundness is 0.82, and coarsest coefficient K=20.95μm3/s.

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  • 收稿日期:2022-03-04
  • 最后修改日期:2022-03-17
  • 录用日期:2022-03-23
  • 在线发布日期: 2022-10-11
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